The trailing slash on the github uri causes fetch failures. Ex:
Cloning into bare repository '.../downloads/git2/github.com.intel.thermal_daemon.'...
ERROR: Repository not found.
fatal: Could not read from remote repository.
Signed-off-by: Christopher Larson <chris_larson@mentor.com>
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
This is a check to avoid loading gma500 module on certain older hardware
using 32 bit BSP where gma was claiming ownership of graphics when it
shouldn't have.
The platforms for which this was added aren't supported anymore so
remove.
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
It's useful to have these so someone who is looking at layer index
as an example knows what the component is.
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
Allow to build with musl, as it is fixed in a new version.
Signed-off-by: Alexander Usyskin <alexander.usyskin@intel.com>
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
Intel(R) ME TEE Library is the cross-platform access
library for Intel(R) CSME HECI interface.
Sources at: https://github.com/intel/metee
To be used by LMS service.
Signed-off-by: Alexander Usyskin <alexander.usyskin@intel.com>
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
The ADAPTIVE Communication Environment library.
Sources: http://download.dre.vanderbilt.edu/
To be used by LMS service.
Signed-off-by: Alexander Usyskin <alexander.usyskin@intel.com>
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
This reverts commit 946c15720e.
Revert part of commit to keep bbappend file. This file
is required to build and deploy EFI boot stub
Signed-off-by: Naveen Saini <naveen.kumar.saini@intel.com>
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
The platform isn't supported anymore and this isn't tested as a result
with recent kernels supported.
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
Changes from release notes:
- Support of KBL-G with discrete GPU
- Fast removal of any cooling action which was applied once
temperature is normal
- Android support
- Add Hot trip point, which when reached just calls "suspend"
- Adding new tag "DependsOn" which enable/disable trip based on some other trip
- Polling interval can be configured via thermal xml config
- Per trip PID control
- Simplify RAPL cooling device
Also remove upstreamed patches and add a change to fix build failures.
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
Looks for the wrong device node, startup script fails among other
issues and as a result, doesn't work.
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
It's not being maintained anymore and the scripts have not been kept in
sync with upstream for quite some time.
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
From README:
- Workwround for platform with invalid thermal table
- Error printing for RAPL constraint sysfs read on failure
- thermal-conf.xml.auto can be read from /etc/thermald, which allows user to modify
generated thermal-conf.xml from /var/run/thermald and copy to /etc/thermald
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
The code hasn't been touched for over 4 years. Its also unlikely to have
been used much if at all considering our previous lack of EFI boot
partition support.
Signed-off-by: California Sullivan <california.l.sullivan@intel.com>
With the EFI image enhancements, installing to boot allows us to easily
use RMC with the new wic images.
Signed-off-by: California Sullivan <california.l.sullivan@intel.com>
Give it an RPROVIDES rmc-boot so that EFI_PROVIDER rmc-boot can be used
as an install target. RDEPENDS on rmc-db to satisfy its runtime
dependencies. Also add python snippet to set its IMAGE/IMAGE_PREFIX
target for when its chosen as EFI_PROVIDER.
These changes let it work well with the new wks.in file, where
previously it couldn't work with wic at all.
Signed-off-by: California Sullivan <california.l.sullivan@intel.com>
Patch changes:
* 0001-sd-boot-Link-RMC-library-into-bootloader-and-stub.patch removed
because make is no longer used.
* 0001-sd-boot-stub-check-LoadOptions-contains-data.patch removed because
it was accepted upstream.
* 0001-partially-revert-sd-boot-stub-Obtain-PE-section-offs.patch added to
support RMC functionality. Upstream removed a snippet that found the
root directory because they didn't need it anymore, but RMC does.
* 0002-sd-boot-fix-RMC-compatibility-with-systemd-boot-and-.patch added
to support building with meson instead of make.
* Others refreshed
inc file changes:
* Don't commit pin, we can maintain these patches OK for now
* EXTRA_OEMAKE -> EXTRA_OEMESON, and removed some superfluous options
Signed-off-by: California Sullivan <california.l.sullivan@intel.com>
Fix the bbappend file to suit the latest systemd version.
As systemd has now dropped autotools support, using ninja
instead of make in do_compile.
Signed-off-by: Chen Qi <Qi.Chen@windriver.com>
Signed-off-by: California Sullivan <california.l.sullivan@intel.com>
Including a non-existant .inc doesn't cause errors, so just move the
systemd-boot.inc file into the main bbappend. This avoids rebuilding the
package without our changes should grub-efi be the EFI_PROVIDER and we
build systemd-boot, while keeping the RMC changes when rmc-boot is the
EFI_PROVIDER.
Signed-off-by: California Sullivan <california.l.sullivan@intel.com>
systemd-boot shouldn't be stuck on a certain commit just because RMC is.
This effectively upgrades our systemd-boot version from v232 to v234. We
also get to drop a patch that was accepted upstream.
Signed-off-by: California Sullivan <california.l.sullivan@intel.com>
Updated version with patches to ensure thermald with musl and x32.
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
Signed-off-by: California Sullivan <california.l.sullivan@intel.com>
Remove the concept of the common directory and move all the recipes-* dirs
to the top level as a normal layer would be. layer.conf is updated appropriately
Signed-off-by: Saul Wold <sgw@linux.intel.com>
